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Your Camera Development Tool






To fabricate your new camera system faster, more effective, and clearly more
cost-effective than any other conventional camera developer was the provoking
implulse for us to create the new Vesta-Technology Platform.
In doing so, this technology acts as basis on which your new camera system
will be designed.


  • Image sensor: 0.3 up to 8 Megapixel resolution
  • Interface: LVDS, Inova Apix, USB 2.0 or FBAS
  • FPGA functions: (Image Data Parametrization, Overlay, etc...)






  • Vesta camera head boards are available nearly with all Micron image sensors.
    There is to put special emphasis on the advantages of the image sensor bank V022
    which is particularly characterised by a high dynamic range of up to 120 dB.
    With the image sensor bank V125 we are in a position to built for you a high-
    quality and at the same time economical FBAS camera. Completely according to your
    requirements, a new camera can be developed based on this component system.


    *8 Megapixel on request

    Vesta image sensors by MICRON

    for further information, please click on the pictures



    datasheet, image sensor module MT9P001
    datasheet, image sensor module MT9T001
    datasheet, image sensor module MT9V125
    datasheet, image sensor module MT9V111
    datasheet, image sensor module MT9V022


    Options

  • Zoom without zoom optics
  • Optional electronic image stabilisation
  • Optional image adjustment (Pan)
  • Output analogue (PAL/NTSC) or digital
  • Sensors with 1M, 2M, 3M, 5M or 8M* pixel available
  • Development of customer- oriented OEM camera modules with analogue or digital interfaces

  • Example: Smooth zooming without zoom optics














    A special part of the Vesta Technology Platform is the HSC series.
    The HSC series can be used to integrate additional functions directly inside the camera system,
    i. e. image data parametrization, image data processing, or overlay functions.

    HSC-FPGA-Modules overview

    for further information, please click on the pictures



    datasheet, HSC-FPGA-module, Lattice XP
    datasheet, HSC-FPGA-module, Lattice Mach X0
    datasheet, HSC-FPGA-module, Actel ProASIC



    Example of Overlayfunctions



    Overlayfunctions can be processed directly in the camera system
    without a embedded pc.
    Your software on a HSC is protected! It is not possible to copy your software and your ideas!











    A data volume, i.e. due to a 5Megapixel image sensor, is too high
    for a standard interface of USB 2.0.Therefore we introduce the INOVA-
    APIX interface * in our technology platform allowing a user data rate up
    to one Gbit/sec.
    *(CentiVesta-Series)

    Interface-modules overview




  • LVDS-interface, cost-effective and easy to integrate
  • FBAS-interface, connectable with any CCTV monitor (PAL/NTSC, presently only for MT9V-125)
  • USB 2.0-interface, universally applicable (on request)
  • Inova-APIX-interface, high data stream (1Gbit/sec) for automotive environment (CentiVesta-Series)













  • The NanoVesta-series describes the smallest variant of the Vesta-series.
    Similar to a construction kit, the modules can be combined individually. In the smallest
    variant, there is only the first module (1) necessary (MT9V125, PAL/NTSC camera).
    If you want to use an extra overlay function in your camera system, the HSC-FPGA module (2)
    provides this function.
    For connecting your camera system, you can choose between a multitude of interfaces. If you
    use a 3 Megapixel sensor and need to achieve a high data rate, the high capacity INOVA-
    APIX link module (3) handles this feature.



  • 1) Image sensor: 0.3 up to 8 Megapixel resolution
  • 2) FPGA functions: (Image Data Parametrization, Overlay, etc...)
  • 3) Interface: LVDS, Inova Apix, USB 2.0 or FBAS






















  • The CentiVesta-series can be used for automotive applications.
    Especially in this environment high data rates and save data transferences are required.
    Therefore we insert the INOVA-APIX interface in our technology platform allowing a user
    data rate up to one Gbit/sec.




    CentiVesta-image sensor modul

  • Image sensor modul together with HSC-FPGA-module: Micron-MT9V111 with Lattice MachXO
  • Inova-APIX-interface




















  • The new designed wide angle lenses* are responsible for an image low in distortion
    even with 130° lens coverage. The well known 'fish eye effect' as in conventional
    optics does not exist.
    These lenses convince in sharpness and reproduction of colors.

    *presently only for 1/3”- und 1/4”-image sensors




    left: conventional wide angle lenses 100° with "fish eye effect"
    right: distortion free wide lenses without distortion.






















    A new layer composition process, the laser forming,will be employed mainly for the
    production of functions-clamping technology.
    We apply this new technology to develop camera cases with any three-dimensional
    geometries efficient, flexible and automated.



  • Single and mini series production
  • Transfer to line production with die casting technology is possible
  • Flexibility of 3D-variety of shapes and geometrics
  • Very light and compact components
  • Resistent against various chemicals (gas, acids, etc.)
  • Optimized adjustment to the mounting space







  • © Helion GmbH 2008

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